Method for preparing an adhesive bond with a curable composition having reduced shrinkage during cure
US4822683A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 6, 1987 |
| Grant date | Apr 18, 1989 |
| Priority date | — |
| Expiry date | Nov 6, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31515
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A method of forming an adhesive bond between two surfaces to form a bonded structure involves the steps PA0 I. applying to at least one of the surfaces a curable composition containing: PA1 (i) one or more epoxide group containing materials containing at least two epoxide groups per molecule; PA1 (ii) a positive amount of an effectively thermoplastic polyester, which does not react into the curable composition and is present as a blended ingredient, which does not exceed 40 percent by weight based on the total weight of the epoxide and polyester components of the composition, said polyester having a weight average molecular weight from about 1,000 to about 8,000, being nonreactive with the one or more epoxide group containing materials of (a) and being insoluble in the one or more epoxide group containing materials of (i); and PA1 (iii) a curing agent adapted to cure the epoxide group containing materials of (i); and PA0 II. at least partially curing the curable composition to form the bonded structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.