Patent · US Expired

High-impact dimensionally stable polyamide molding compositions

US4822852A · kind A · utility

28Cited by
8References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 26, 1987
Grant dateApr 18, 1989
Priority date
Expiry dateOct 26, 2007

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC08L83/10
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

The invention relates to thermoplastic molding compositions showing improved properties, more especially improved dimensional stability and notched impact strength, particularly at low temperatures, in the form of a mixture of at least 35% by weight of a copolyamide containing polydiorganosiloxane carbonamide units and/or of a mixture of partly crystalline polyamides and (co)polyamides containing polydiorganosiloxane carbonamide units and from 1 to 65% by weight of graft products of vinyl polymers on rubbers. The invention also relates to the dimensionally stable molding compositions tough at low temperatures characterized above which additionally contain amorphous siloxane-free polyamides added in quantities of up to 64% by weight.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.