High-impact dimensionally stable polyamide molding compositions
US4822852A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 26, 1987 |
| Grant date | Apr 18, 1989 |
| Priority date | — |
| Expiry date | Oct 26, 2007 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L83/10
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention relates to thermoplastic molding compositions showing improved properties, more especially improved dimensional stability and notched impact strength, particularly at low temperatures, in the form of a mixture of at least 35% by weight of a copolyamide containing polydiorganosiloxane carbonamide units and/or of a mixture of partly crystalline polyamides and (co)polyamides containing polydiorganosiloxane carbonamide units and from 1 to 65% by weight of graft products of vinyl polymers on rubbers. The invention also relates to the dimensionally stable molding compositions tough at low temperatures characterized above which additionally contain amorphous siloxane-free polyamides added in quantities of up to 64% by weight.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.