Semiconductor device and method of manufacturing thereof
US4822989A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 21, 1987 |
| Grant date | Apr 18, 1989 |
| Priority date | — |
| Expiry date | May 21, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
This invention concerns a semiconductor device of a tape carrier type and a method of manufacturing the same, wherein electroconductive layers made of the same material as that of lead terminals are disposed so as to substantially surround the circumferential edge of a hole for containing an IC chip with a predetermined gap as barrier portions for controlling the flowing range or the coating range on a carrier tape before coagulation of the coating material when the surface of said IC chip after being inserted into the IC chip-containing hole and connected with the lead terminals is coated with the coating material. The steps formed with the surface of the carrier tape and the barrier portions which substantially surround the circumferential edge of the hole at a predetermined gap thereby results in controlling the flowing range of the coating material before coagulation, by which the coating region on the surface of the IC chip, etc. with the coating material is made uniform and the scattering in the film thickness is minimized.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.