Semiconductor device and its manufacture
US4823234A · kind A · utility
170Cited by
11References
39Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 1, 1986 |
| Grant date | Apr 18, 1989 |
| Priority date | — |
| Expiry date | Jul 1, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49151
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device of the kind wherein one or more semiconductor chips are housed in a plug-in type package. The package is being molded with a printed wiring substrate, head portions of terminals, and a heat sink for semiconductor chip attachment as an integral part of the package. The one surface of the heat sink is being bared from one side of the package, and the semiconductor chips are being mounted on the other surface of the heat sink facing to the opening of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.