Forming plated through holes in a printed circuit board by using a computer controlled plotter
US4823277A · kind A · utility
6Cited by
6References
25Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 10, 1986 |
| Grant date | Apr 18, 1989 |
| Priority date | — |
| Expiry date | Nov 10, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/082
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Plated through holes in a printed circuit board can be conveniently produced during manufacture of the circuit board under the control of a computer controlled plotter by the use of a pen-like instrument which positively displaces a thick film fluid conductive adhesive on a tip of the instrument. The fluid is smeared onto the side walls of the hole by moving the tip in a peripheral motion around the side wall of the hole. Copper is electroplated directly onto the conductive adhesive. Resist material is applied in a similar fashion prior to etching the circuit traces on the surface sheets of the circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.