Method for depositing a solderable metal layer by an electroless method
US4824693A · kind A · utility
6Cited by
5References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 19, 1988 |
| Grant date | Apr 25, 1989 |
| Priority date | — |
| Expiry date | Feb 19, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0761
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
To deposit a solderable metal layer on conductive paths (4) of ITO on substrates of display devices (1) by an electroless method, the conductive paths are activated, prior to the deposition, and the areas not covered by the conductive paths are subsequently inactivated. The activated paths are then metallized with a solderable metal layer so that integrated circuits can be soldered to the metallized conductive paths.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.