Poly-1-butene blend adhesives
US4824889A · kind A · utility
41Cited by
20References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 30, 1987 |
| Grant date | Apr 25, 1989 |
| Priority date | — |
| Expiry date | Oct 30, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31913
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A hot melt adhesive comprising a blend of: PA0 from about 10% by weight to about 90% by weight of a blend of from 10% by weight to 90% by weight of an at least partially crystalline copolymer of butene-1 and ethylene, wherein the ethylene content is from about 1 mole percent to about 20 mole percent of said copolymer, and from 10% by weight to 90% by weight of a butene-1 homopolymer; PA0 from about 10% by weight to about 90% by weight of a tackifying resin; and PA0 from about 0.1 phr to about 0.5 phr of an antioxidizing agent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.