Temperature compensated piezoelectric transducer assembly
US4825117A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 27, 1987 |
| Grant date | Apr 25, 1989 |
| Priority date | — |
| Expiry date | Nov 27, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N30/88
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
An apparatus for monitoring the curing of a fiber reinforced composite plastic which is cured at temperatures of the order of 350.degree. C. and an ultrasonic transducer assembly useful in the apparatus. The transducer assembly comprises a lithium niobate piezoelectric element having anisotropic coefficients of thermal expansion which is mounted on a metal base of the transducer assembly by means of a layer of structured copper. The structured copper is thermo-compression diffusion bonded to the lithium niobate element and to the metal base, and is compliant in a transverse direction to compensate for differential thermal expansions while affording good electrical and thermal conductivity and good acoustic coupling between the lithium niobate element and metal base.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.