Radiation curable temporary solder mask
US4826705A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 15, 1987 |
| Grant date | May 2, 1989 |
| Priority date | — |
| Expiry date | Jun 15, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0759
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A composition and method for providing temporary masking of electrical and electronic components compatible with a high speed production operation. The composition is a radiation curable viscous liquid composition which provides minimal adhesion properties and substantial cohesive properties so that when cured, it can be readily removed in the manner of an adhesive tape. In particular, the radiation curable composition is characterized by cured properties a) of positive adhesion to the substrate to which the composition is applied, but insufficient adhesion to resist peeling forces applied by hand; and b) of sufficient cohesive strength to allow substantially all of the cured composition to be stripped mechanically or by hand in a single piece. Suitably the adhesion of the cured composition (22) to the substrate (16) as measured in the tensile shear mode, is between about 5 and 55 psi. This level of adhesion is sufficient to prevent ingress of solvent solder, plating or coating materials but low enough to allow easy dry stripping mechanically or by hand.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.