Thermal ink jet printhead assembly employing beam lead interconnect circuit
US4827294A · kind A · utility
121Cited by
9References
3Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 26, 1987 |
| Grant date | May 2, 1989 |
| Priority date | — |
| Expiry date | Oct 26, 2007 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2002/14362
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
This application discloses a new and improved thermal ink jet printhead and method of manufacture wherein a tape automated bond (TAB) flexible circuit is sequentially thermosonically bonded in a one-by-one wire bonding process to aligned conductive traces on a thin film resistor substrate. These traces provide electrical current paths for a corresponding plurality of heater resistors on the substrate, and these resistors function to heat a corresponding plurality of ink reservoirs in a thermal ink jet printhead.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.