Heat dissipating interconnect tape for use in tape automated bonding
US4827376A · kind A · utility
60Cited by
16References
23Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 18, 1987 |
| Grant date | May 2, 1989 |
| Priority date | — |
| Expiry date | Dec 18, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12201
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention is directed to electronic packages. A heat dissipating pad positioned over the electrically active face of an electronic device transfers heat from the device to the electronic package or to an external heat sink. A dielectric electrically isolates the heat dissipating pad from the electronic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.