Moving jaw reflow soldering head
US4828162A · kind A · utility
25Cited by
40References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 29, 1988 |
| Grant date | May 9, 1989 |
| Priority date | — |
| Expiry date | Feb 29, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53274
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Apparatus for gripping and removing integrated circuits, including four heatable jaws movable into gripping relation with soldered integrated circuit leads. The heatable jaws are mounted to respective leveler plates, each of which is suspended from a base member by a pivotable gripper arm and three flexure arms. Individual air cylinders are selectively actuable to pivot the gripper arms and thereby achieve inward motion and gripping action of the jaws. A second embodiment employs a cam follower mechanism rather than air cylinders to actuate similarly-mounted jaw elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.