Elastomeric ball pressurizing method for adhesive bonding of assemblies
US4828639A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 26, 1987 |
| Grant date | May 9, 1989 |
| Priority date | — |
| Expiry date | Aug 26, 2007 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C43/32
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An improved method for forming an assembly of laminated materials is provided. The method eliminates an necessity to evacuate a package or position the assembly in an autoclave for forming. In the method, the assembly (14, 70) is positioned against the die face of a rigid die (12, 72). A cavity of essentially constant volume is formed about the die and assembly and encloses the side of the assembly opposite that in contact with the rigid die. The cavity is filled with expandable spheroids (56). The spheroids are expanded to provide the necessary force on the assembly to urge the assembly against the rigid die to form the completed assembly. Preferably, the expandable spheroids (56) are thermally expandable and can comprise, for example, silicone rubber having a coefficient of thermal expansion of about 50.times.10.sup.-5 inches per inch per degree Fahrenheit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.