Imaging process for forming ceramic electronic circuits
US4828961A · kind A · utility
23Cited by
9References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 2, 1986 |
| Grant date | May 9, 1989 |
| Priority date | — |
| Expiry date | Jul 2, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/056
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Electronic circuits are made with a ceramic body and electrical components which can be disposed in different layers. Interconnecting means can be provided which are disposed entirely within the body. The ceramic body and the electrical components are sintered to form a monolithic structure in a single firing. The electrical components are formed in layers by mixing the electrical component in a sinterable form with a radiation sensitive material which serves as a binder. After exposure to radiation in the desired pattern the layer is developed to form the desired pattern. Multiple patterns can be formed prior to firing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.