Patent · US Expired

Method of mounting surface-mounted type electronic components on a printed circuit board

US4829663A · kind A · utility

11Cited by
7References
8Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 25, 1988
Grant dateMay 16, 1989
Priority date
Expiry dateMar 25, 2008

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T29/53178
  • WIPO fieldAudio-visual technology
  • WIPO sectorElectrical engineering

Abstract

A method of mounting surface-mounted type electronic components on a printed circuit board adapted to be carried out using an electronic component series which comprises a carrier tape formed with a plurality of tiny recess portions for receiving therein adhesives for use in temporary fixing of surface-mounted type electronic components on a printed circuit board, adhesives received in the respective recess portions, and a plurality of surface-mounted type electronic components held on the carrier tape through the adhesives. In the present invention, the taking up of the electronic component from the carrier tape is performed while pushing up the tiny recess portion of the carrier tape to cause the same portion to be deformed, so that the electronic component can be easily removed together with the adhesive from the carrier tape, and the removed electronic component is then placed on a printed circuit board to be temporarily held on the printed circuit board through the adhesive having adhered on the bottom surface of the electronic component.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.