Method for mounting electronic components
US4829664A · kind A · utility
3Cited by
1References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 19, 1987 |
| Grant date | May 16, 1989 |
| Priority date | — |
| Expiry date | Nov 19, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53178
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Electronic components are adhesively held by a flexible, expansible and contractible adhesive sheet, and pressing pins pressing one of the electronic component on a position to be mounted on a printed circuit substrate with penetrating the adhesive sheet. Then, electronic component is separated from the adhesive sheet by bringing up the adhesive sheet and at that time the electronic component is fixed on the printed circuit substrate by the pressing pins.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.