Method and apparatus for mounting electronic components
US4829665A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 30, 1987 |
| Grant date | May 16, 1989 |
| Priority date | — |
| Expiry date | Nov 30, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53261
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In mounting electronic components (1) from an electronic components pack (5) to a substrate (10), the substrate (10) is put on a table movable horizontally in X-Y directions, and the electronic components (1) are held in through holding holes (3) in a holding plate (2). A selected one of the electronic components (1) is positioned just above a mounting position on the substrate (10) and a pushing pin (23 or 24 or 26) is positioned just above that electronic component (1). Then, the pushing pin (23 or 24 or 26) lowers and pushes the selected electronic component (1) down out of its holding hole (3) to mount it directly onto the substrate (10).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.