Curing oven system for semiconductor devices
US4830609A · kind A · utility
1Cited by
7References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 13, 1988 |
| Grant date | May 16, 1989 |
| Priority date | — |
| Expiry date | Jun 13, 2008 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF27D5/0037
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
An automated curing oven system for use in the manufacturing of semiconductors. This system may easily be incorporated with other automated machinery used for various semiconductor processing steps because it employs the same device holding magazine used for many other steps. The device holding magazine serves as the oven chamber itself thereby eliminating many manual handling steps.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.