Process for the production of printed circuit boards
US4830714A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 22, 1987 |
| Grant date | May 16, 1989 |
| Priority date | — |
| Expiry date | Apr 22, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1407
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An elegant method for the production of printed circuit boards possessing good electrical and mechanical properties comprises activating baseplates with a solution of complex compounds of elements of sub-group I or VIII of the periodic table, then applying a resist layer, exposing this partially according to a resist pattern, dissolving away the covered parts of the resist layer with a solvent, and metallizing the bared parts in a wet-chemical metallization bath in the absence of a current.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.