Patent · US Expired

Process for the production of printed circuit boards

US4830714A · kind A · utility

11Cited by
6References
9Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 22, 1987
Grant dateMay 16, 1989
Priority date
Expiry dateApr 22, 2007

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH05K2203/1407
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

An elegant method for the production of printed circuit boards possessing good electrical and mechanical properties comprises activating baseplates with a solution of complex compounds of elements of sub-group I or VIII of the periodic table, then applying a resist layer, exposing this partially according to a resist pattern, dissolving away the covered parts of the resist layer with a solvent, and metallizing the bared parts in a wet-chemical metallization bath in the absence of a current.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.