Electrically conductive resin composition
US4830779A · kind A · utility
46Cited by
3References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 17, 1987 |
| Grant date | May 16, 1989 |
| Priority date | — |
| Expiry date | Dec 17, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01B1/22
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An electrically conductive resin composition comprising: PA0 (i) a resin; PA0 (ii) a metallic powder; PA0 (iii) a diphosphonic acid derivative; and PA0 (iv) a hydroxyl-containing compound; wherein the weight ratio of the compound (i)/the component (ii) is 30/70 to 85/15 and the amounts of the components (iii) and (iv) are 0.5 parts by weight or more and 0.08 parts by weight, respectively, based on 100 parts by weight of the components (i) and (ii).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.