Poly-1-butene blend adhesives for laminar structure
US4830926A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Aug 31, 1988 |
| Grant date | May 16, 1989 |
| Priority date | — |
| Expiry date | Aug 31, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31913
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A laminar structure comprising a substrate and a hot melt adhesive, wherein said hot melt adhesive comprises: PA1 (A) a butene-1 polymer blend of from 10% by weight of 90% by weight of an at least partially crystalline copolymer of butene-1 and ethylene, wherein the ethylene content is from about 1 mole % to about 20 mole % of said copolymer, and from 10% by weight to 90% by weight of a butene-1 homopolymer; PA1 (B) from about 20% by weight to about 60% by weight of a substantially non-polar tackifying resin selected from the group consisting of polyterpene and aliphatic resins from C.sub.5 -C.sub.9 hydrocarbon streams or hydrogenated resins thereof with softening points in the range of 70.degree. C. to 130.degree. C.; and PA1 (C) from about 0.1 phr to about 0.5 phr of an antioxidizing agent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.