Moldable elastomeric pressure sensitive adhesives
US4831070A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 2, 1987 |
| Grant date | May 16, 1989 |
| Priority date | — |
| Expiry date | Nov 2, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S528/901
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A composition and method for forming elastomeric pressure sensitive adhesives comprising a mixture of (A) a xylene-soluble resin copolymer of 0.6 to 0.9 triorganosiloxy units per SiO.sub.4/2 unit and having less than 0.7 weight % silicon-bonded hydroxyl units. (B) a polydiorganosiloxane fluid endcapped with silicon-bonded hydroxyl groups and having a viscosity of from about 50 to 300,000 cP. at 25.degree. C., an organosilicon compound containing an average of more than two silicon-bonded alkoxy groups per molecule, and a condensation catalyst. The cured elastomeric pressure sensitive adhesives formed from these compositions are useful as medical adhesives, such as those used for ostomy seals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.