Imaging apparatus using a solid-state imaging element having a substrate
US4831456A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Oct 26, 1987 |
| Grant date | May 16, 1989 |
| Priority date | — |
| Expiry date | Oct 26, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N23/555
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An imaging apparatus includes a camera head and a camera control unit. An objective optical system is arranged at a front end portion of the camera head. A solid-state imaging device having a first external terminal group to or from which signals subjected to signal processing inside the camera head are input or output, and a second external terminal group, which is separated from the first external terminal group, and to or from which signals that are not subjected to signal processing inside the camera head are input or output, is arranged behind the objective optical system. A circuit board has at least two connecting terminal groups. One connecting terminal group of the circuit board is connected to the first external terminal group, and the other connecting terminal group is connected to one end portion of a first conductive wire group of a power cable. One end portion of a second conductive wire group of the power cable is connected to the second external terminal group. The other end portion of each of the first and second conductive wire groups is connected to the camera control unit. Therefore, the camera head can be rendered compact.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.