Method for manufacturing a laminar bond and apparatus for conducting the method
US4832253A · kind A · utility
8Cited by
2References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 15, 1988 |
| Grant date | May 23, 1989 |
| Priority date | — |
| Expiry date | Mar 15, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53678
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a method for the firm bonding at elevated temperatures of thin, large-area wafers of different thermal expansion the deformations of the laminar bond occurring later during cooling are at least partially compensated by an appropriate pre-deformation in the opposite direction. An apparatus for conducting the method uses the different thermal expansion of a housing (1) and a ring-shaped thermal expansion element (3) to produce the pre-deformation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.