Patent · US Expired

System For improved flaw detection in polycrystalline diamond

US4832708A · kind A · utility

10Cited by
10References
12Claims
0Family size

Assignee

Inventor

Key dates

Filing dateJan 29, 1987
Grant dateMay 23, 1989
Priority date
Expiry dateJan 29, 2007

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB01J2203/0685
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

Disclosed is an improvement enabling a more reliable detection of flaws in polycrystalline diamond compacts by x-ray imaging and expecially for compacts used for wire drawing dies. In an embodiment, wire die compacts are prepared having a plycrystalline diamond core disposed within a metal carbide annulus. In the core are uniformly dispersed less than five (5) percent by weight particles such as tungsten carbide which initially have an average particle size substantially less than the diamond particles used to form polycrystalline mass.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.