Method and apparatus for plating composite
US4832798A · kind A · utility
15Cited by
3References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 16, 1987 |
| Grant date | May 23, 1989 |
| Priority date | — |
| Expiry date | Dec 16, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S205/918
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method and apparatus for improving the integrity of metal plated composites is disclosed. Plating improvements are achieved by first irradiating a nickel plated substrate, prior to application of a noble metal plating layer, to smooth any surface discontinuities or irregularities. Excimer laser pulses, having a duration of less than 100 nanoseconds, are employed to partially liquefy the upper surface of the nickel plating on the substrate. This invention is compatible with conventional plating processes, such as electroplating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.