Electroplating apparatus for plate-shaped workpieces, particularly printed circuit boards
US4832811A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jan 22, 1988 |
| Grant date | May 23, 1989 |
| Priority date | — |
| Expiry date | Jan 22, 2008 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D7/0614
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electroplating apparatus for plating plate-shaped workpieces, particularly printed circuit boards, as they move in a horizontal path through a tank of electrolyte between an upper anode and a lower anode characterized by the device including four electrolyte headers arranged with a pair at the input of the path between the upper and lower anodes, and a pair at the end of the path between the upper and lower anodes, with each pair having one header disposed above the path and one header disposed below the path. Each of the headers as a plurality of openings extending at an attack angle to the horizontal path to create both horizontal and vertical components for a flow of the electrolyte between the surfaces of the workpieces and each of the upper and lower anodes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.