Patent · US Expired

Method of improving the bond strength of electrolessly deposited metal layers on plastic-material surfaces

US4832989A · kind A · utility

15Cited by
4References
5Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 10, 1987
Grant dateMay 23, 1989
Priority date
Expiry dateJul 10, 2007

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH05K3/387
  • WIPO fieldAudio-visual technology
  • WIPO sectorElectrical engineering

Abstract

Activator formulations which contain copolymers of (meth)acrylonitrile, styrenes, acrylates and/or unsaturated acids as binders are excellently suitable for preparing nonmetallic substrate surfaces for electroless metallization. The metal deposits produced are notable for good bond strength.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.