Method of improving the bond strength of electrolessly deposited metal layers on plastic-material surfaces
US4832989A · kind A · utility
15Cited by
4References
5Claims
0Family size
Assignee
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Key dates
| Filing date | Jul 10, 1987 |
| Grant date | May 23, 1989 |
| Priority date | — |
| Expiry date | Jul 10, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/387
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Activator formulations which contain copolymers of (meth)acrylonitrile, styrenes, acrylates and/or unsaturated acids as binders are excellently suitable for preparing nonmetallic substrate surfaces for electroless metallization. The metal deposits produced are notable for good bond strength.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.