Structure of copper conductor and method of forming same
US4833004A · kind A · utility
6Cited by
4References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 8, 1982 |
| Grant date | May 23, 1989 |
| Priority date | — |
| Expiry date | Jan 8, 2002 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24926
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A structure of a copper conductor is obtained by oxidizing copper film formed on the surface of a substrate, and by heat treating the same in a reducing atmosphere, whereby only the surface layer portion of the oxidized copper film is reduced to become copper. The copper film of a conductor is formed on the surface of the substrate with the oxidized copper film interposed therebetween. As a result, an adhesion of the copper film to the surface of the substrate is enhanced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.