Process for preparing moldings based on silicon oxycarbide

US4833220A · kind A · utility

Assignee

• Wacker Chemie AG · DE

Inventors

• Volker Frey · Burghausen, DE
• Bernd Pachaly · Schweich, DE
• Norbert Zeller · Burghausen, DE

Key dates

• Filing date: Jun 17, 1988
• Grant date: May 23, 1989
• Expiry date: Jun 17, 2008

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C04B35/571
• WIPO field: Materials, metallurgy
• WIPO sector: Chemistry

Abstract

The invention relates to a process for preparing moldings based on silicon oxycarbide, which comprises reacting a molding containing from 50 to 90 percent by weight of silicon oxycarbide having an average particle size of from 0.5 to 50 um with from 10 to 50 percent by weight of a silicone resin having the general formula EQU [(CH.sub.3 SiO).sub.x (OR).sub.y (OH).sub.z ].sub.n, in which R is an alkyl radical having from 1 to 4 carbon atoms, x is in the range of from 1.4 to 1.5, y is in the range of from 0 to 0.08, z is in the range of from 0 to 0.08 and n is in the range of from 20 to 40, under a nonoxidizing atmosphere or in a vacuum at temperatures in the range of from 700.degree. to 1500.degree. C.