Semiconductor laser module of dual in-line package type including coaxial high frequency connector
US4834491A · kind A · utility
28Cited by
9References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 28, 1988 |
| Grant date | May 30, 1989 |
| Priority date | — |
| Expiry date | Jun 28, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/06226
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A semiconductor laser module containing a semiconductor laser therein is disclosed, in which the insulated conductor of a coaxial-type high-frequency connector fixed to the outer wall suface of a dual in-line package is connected to an airtight terminal mounted on the package and connected electrically with the semiconductor laser in the package. Thus, a high-frequency signal in the giga bit band can be readily applied to the semiconductor laser through the coaxial-type high-frequency connector, without degrading the airtightness of the dual in-line package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.