Tungsten paste for co-sintering with pure alumina and method for producing same
US4835039A · kind A · utility
22Cited by
5References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 26, 1986 |
| Grant date | May 30, 1989 |
| Priority date | — |
| Expiry date | Nov 26, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24926
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A tungsten paste suitable for co-sintering with 98+% alumina substrate can be produced by adding selected compositions of glass to the paste. Circuit packages produced in accordance with the present invention exhibit superior thermal conductivity, low shrinkage variability, and smoother and more homogeneous surface finish. A preferred embodiment of the invention utilizes a substrate comprising narrow size range alumina powder, thus yielding lower sintering temperature and further improvements in shrinkage variability and surface finish.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.