Method and apparatus for venting vacuum processing equipment
US4836233A · kind A · utility
16Cited by
4References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 6, 1988 |
| Grant date | Jun 6, 1989 |
| Priority date | — |
| Expiry date | Jun 6, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T137/7759
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Controlled, low-turbulence venting of a semiconductor processing vacuum chamber is provided by a venting system including sensing elements for sensing gas conditions, including pressure, in the chamber during venting, and vent rate control elements, including a flow rate regulator valve, responsive to the sensing elements for attaining a venting rate approaching a selected maximal venting rate threshold of sonically choked flow, thereby attaining enhanced non-sonically-choked venting.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.