Semiconductor devices having superconducting interconnects
US4837609A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 9, 1987 |
| Grant date | Jun 6, 1989 |
| Priority date | — |
| Expiry date | Sep 9, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S505/923
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device which includes either a single semiconductor chip bearing an integrated circuit (IC) or two or more electrically interconnected semiconductor chips, is disclosed. This device includes interconnects between device components (on the same chip and/or on different chips), at least one of which includes a region of superconducting material, e.g., a region of copper oxide superconductor having a T.sub.c greater than about 77K. Significantly, to avoid undesirable interactions, at high processing temperatures, between the superconducting material and underlying, silicon-containing material (which, among other things, results in the superconducting material reverting to its non-superconducting state), the interconnect also includes a combination of material regions which prevents such interactions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.