Method and apparatus for EMI/RFI shielding an infrared energy reflow soldered device
US4838475A · kind A · utility
39Cited by
7References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 28, 1987 |
| Grant date | Jun 13, 1989 |
| Priority date | — |
| Expiry date | Aug 28, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An EMI/RFI shield (10) comprises a box like structure formed of a metal integral member having a plurality of apertures (16) formed therethrough. The apertures (16) are of a size appropriate to substantially pass infrared energy (22) and to substantially block EMI/RFI energy (26). When placed on a substrate (18), infrared energy (22) can be utilized to reflow solder a device (19) encapsulated by the shield (10) to the substrate (18).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.