High density interconnect system
US4838800A · kind A · utility
39Cited by
3References
1Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 23, 1988 |
| Grant date | Jun 13, 1989 |
| Priority date | — |
| Expiry date | May 23, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S439/931
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Plated-through-holes of printed circuit boards are segmented to provide a plurality of conductors. Matching connector pins having insulating cores and patterned conductive portions are mated with the conductors of the plated-through-holes. Each of the conductors of the holes can be connected to a different one of the patterns on the printed circuit boards thus forming a high density interconnect system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.