Method of removing outer protective layer from edible materials using laser energy
US4839181A · kind A · utility
31Cited by
1References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 30, 1987 |
| Grant date | Jun 13, 1989 |
| Priority date | — |
| Expiry date | Nov 30, 2007 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA22C25/17
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Skin is removed from an edible material by passing the edible material through a skin removal zone of an ablative removal apparatus. In the skin removal zone, skin is ablatively removed by the action of a continuous wave carbon dioxide laser beam which rapidly traverses the skin removal zone in a direction substantially transverse to the edible material movement. The edible material may be skinned regardless of whether it is fresh, frozen, thawed, or cooked. Skin vaporized by the laser light beam generates a gaseous plume which is removed from the skin removal zone by causing a current of air to traverse that zone.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.