Flexible laminate printed-circuit board and methods of making same
US4839232A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 25, 1987 |
| Grant date | Jun 13, 1989 |
| Priority date | — |
| Expiry date | Jun 25, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A polyimide film formed by using a symmetrical aromatic meta-substituted primary diamine and a symmetrical aromatic para-substituted primary diamine as raw materials in a specific proportion has excellent heat resistance, electrical properties, flexibility and the like. Such a polyimide film can be bonded to a metal foil not by using any adhesive, but by coating the metal foil with a polyamic acid constituting a precursor of the polyimide and further reacting the polyamic acid to convert it to the polyimide. In this manner, there can be obtained a flexible laminate for printed-circuit board comprising a polyimide film bonded to a metal foil with good adhesion and exhibiting excellent properties as described above.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.