Thermoplastic resin composition comprising a polyphenylene ether and a polyamide
US4839425A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 30, 1987 |
| Grant date | Jun 13, 1989 |
| Priority date | — |
| Expiry date | Mar 30, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S525/905
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A thermoplastic resin composition obtained by melt-mixing: PA0 (a) 4 to 95% by weight of a polyphenylene ether resin, PA0 (b) 4 to 95% by weight of a polyamide, PA0 (c) 1 to 50% by weight of a rubbery polymer, and PA0 (d) if necessary, 91% by weight or less of a styrene resin (d) [the sum of the (a), (b), (c) and (d) components is 100% by weight] in the presence of 0.001 to 10% by weight, based on the total weight of the (a), (b), (c) and (d) components, of at least one functional group-containing unsaturated compound having at least one group selected from the class consisting of carboxyl group, acid anhydride group, epoxy group, hydroxyl group, amino group and amido group and 0.001 to 5% by weight, based on the total weight of the (a), (b), (c) and (d) components, of a peroxide. This thermoplastic resin composition is excellent in balance of impact strength of thin molded product, moldability and heat resistance. Therefore, the composition can be used as molded products such as external and internal trim parts of automobiles, electric and electronic components, housings and the like, requiring a high quality, and accordingly is highly valuable in industrial utilization.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.