Arrangement for machining workpieces by means of a laser beam by building up a plasma that is to be kept within limits
US4839493A · kind A · utility
11Cited by
4References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 17, 1986 |
| Grant date | Jun 13, 1989 |
| Priority date | — |
| Expiry date | Apr 17, 2006 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/032
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In machining a workpiece, maximal absorption of laser irradiation in the workpiece is achieved by a minimal interference by optical back-coupling and plasma effects is achieved by continuously determining the actual value of the laser irradiation and continuously sensing stochastic processes taking place in the machining zone and in response to such measuring and sensing, controlling the modulation of laser irradiation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.