Patent · US Expired

Arrangement for machining workpieces by means of a laser beam by building up a plasma that is to be kept within limits

US4839493A · kind A · utility

11Cited by
4References
11Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 17, 1986
Grant dateJun 13, 1989
Priority date
Expiry dateApr 17, 2006

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB23K26/032
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

In machining a workpiece, maximal absorption of laser irradiation in the workpiece is achieved by a minimal interference by optical back-coupling and plasma effects is achieved by continuously determining the actual value of the laser irradiation and continuously sensing stochastic processes taking place in the machining zone and in response to such measuring and sensing, controlling the modulation of laser irradiation.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.