Ceramic package for high frequency semiconductor devices
US4839717A · kind A · utility
114Cited by
7References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 7, 1988 |
| Grant date | Jun 13, 1989 |
| Priority date | — |
| Expiry date | Jun 7, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A ceramic semiconductor package suitable for high frequency operation includes internal and external ground planes formed on opposite faces of a ceramic base member. The internal ground plane is connected to a ground ring formed on the packaged semiconductor device, and both ground planes are interconnected about the periphery of the package. In this way, a uniform and continuous ground is provided to minimize variations in signal transmission line impedance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.