Mold release composition
US4840675A · kind A · utility
12Cited by
3References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 26, 1988 |
| Grant date | Jun 20, 1989 |
| Priority date | — |
| Expiry date | Sep 26, 2008 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC10N2050/02
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A process for imparting releasing property to a mold which comprises applying to the mold a composition comprising: PA0 (A) (1) a fluorine-containing urethane compound represented by the formula ##STR1## and/or (2) a fluorine-containing urethane compound represented by the formula ##STR2## and/or (3) a fluorine-containing urethane compound represented by the formula ##STR3## and (B) at least one of members selected from the class consisting of silicone oil, silicone varnish, wax and a highly fluorinated organic compound and the mold release composition used for the process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.