Apparatus and method for plasma treating of circuit boards
US4840702A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Dec 29, 1987 |
| Grant date | Jun 20, 1989 |
| Priority date | — |
| Expiry date | Dec 29, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/095
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An apparatus and method for improved plasma treating of circuit boards is disclosed wherein a plasma treating zone and a gas resupply zone are established in a chamber, an actuating mechanism being provided to establish relative movement between the circuit boards and the zones during treatment of the circuit boards. The apparatus preferably includes a chamber for receipt of a gas and having electrodes centrally positioned therein for generating an electrical field at a central portion of the chamber thereby exciting the gas thereat and creating a zone of intense plasma. A transport mechanism is provided in the chamber for moving the circuit boards alternately into and out of the central portion of the chamber for preselected periods of time thus alternately exposing the circuit boards to the intense plasma and to substantially fresh gas outside of the central portion of the chamber thereby providing more uniform plasma treatment of the surface areas of the circuit boards and improved cleaning and etching of openings through the circuit boards which receive a fresh supply of gas therein when the circuit boards are outside of the central portion of the chamber. Using appropriate ele…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.