Method of encapsulating electronic devices
US4842800A · kind A · utility
12Cited by
3References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 1, 1987 |
| Grant date | Jun 27, 1989 |
| Priority date | — |
| Expiry date | Oct 1, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A method for encapsulating microelectronic devices is provided using a heat curable epoxy composition having a monomeric or polymeric diaryliodonium hexafluoroantimonate salt. Curable compositions are also provided as well as encapsulated microelectronic devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.