Method for treating a polyimide surface to improve the adhesion of metal deposited thereon, and articles produced thereby
US4842946A · kind A · utility
29Cited by
3References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 28, 1987 |
| Grant date | Jun 27, 1989 |
| Priority date | — |
| Expiry date | Sep 28, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31725
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for treating a polyimide surface is disclosed, in which an adhesion-promoting compound such as thiourea contacts the surface prior to the electroless plating of metal thereon. Articles formed by such a method are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.