Method for encapsulating electronic devices
US4843036A · kind A · utility
57Cited by
17References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 29, 1987 |
| Grant date | Jun 27, 1989 |
| Priority date | — |
| Expiry date | Jun 29, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of encapsulating an electronic device on a substrate comprises depositing a radiatively curable barrier wall to contain a subsequently deposited encapsulant. Alternatively, an encapsulant comprising a majority of radiatively curable material is used in the absence of a barrier wall.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.