Solder system and method of using same
US4844324A · kind A · utility
9Cited by
15References
24Claims
0Family size
Inventor
Key dates
| Filing date | Sep 29, 1987 |
| Grant date | Jul 4, 1989 |
| Priority date | — |
| Expiry date | Sep 29, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53191
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A solder system is adapted for use in soldering the terminals of a plurality of circuit boards, to corresponding leads of a plurality of cables. The solder system includes a holding fixture for supporting adjustably the circuit boards relative to the corresponding cablels. A gripper assembly retains the cable leads in position above the corresponding board terminals. A monitor assembly is utilized to supervise optically the various stages of the soldering process. A heater assembly is mounted adjustably above the holding fixture for reflowing the solder material over the aligned cable leads and board terminals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.