Homodyne interconnections of integrated circuits
US4844571A · kind A · utility
4Cited by
0References
18Claims
0Family size
Inventor
Key dates
| Filing date | May 18, 1987 |
| Grant date | Jul 4, 1989 |
| Priority date | — |
| Expiry date | May 18, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04B10/63
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An optical interconnection system for integrated circuits has an optical source that is split into at least two parts. One part is modulated and the other part is transmitted to a detector and input on the local oscillator signal in homodyne detection. A single source may be split many ways to provide a plurality of beams for modulating and a plurality of local oscillator inputs to separate detectors. Both inter and intra wafer connections are described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.