Optical transmission package
US4844581A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Apr 22, 1987 |
| Grant date | Jul 4, 1989 |
| Priority date | — |
| Expiry date | Apr 22, 2007 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4224
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An injection laser package having a housing and an optical fiber pigtail extending onto a sub-mount of a mount with the sub-mount being formed of a plurality of thick film layers which incorporate a resistance heating element and etched conductors which are insulated from a narrow solder pad. With the end portion of the fiber in alignment with the injection laser chip, a current is applied to the conductors to heat the sub-mount and melt the solder pad to thereby hold the fiber exactly in alignment with the chip. The portion of the fiber extending between the sub-mount and the inner end of the entrance support tube remains unsupported and thereby flexible so that external stresses on the package housing and, particularly, a support tube do not transfer any strain to the end portion of the fiber so that alignment with the injection laser chip is maintained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.