Method of packaging a non-contact I/O signal transmission integrated circuit
US4845052A · kind A · utility
21Cited by
46References
3Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 13, 1988 |
| Grant date | Jul 4, 1989 |
| Priority date | — |
| Expiry date | Jan 13, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S148/099
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The I/O ports of a packaged IC includes a plurality of optical conduits in the package adjacent electro-optical transmitters and receivers throughout the die spaced from the periphery of the die. The method of assembling the die in the package includes using optical transmitters on the die to align the top of the package and the optical conduits to the die which was previously mounted in the base of the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.